Tuesday, August 16, 2011
Chris Rowen, CTO and founder of Tensilica, will present, “The World’s Fastest DSP Core: Breaking 100 GMAC/s Barrier,” at the HOT CHIPS 23 symposium in Stanford, CA, on August 18. Dr. Rowen will discuss the accelerated transition to 4G wireless connectivity through LTE and LTE-Advanced that mandates a more programmable baseband architecture. He will disclose the rationale, machine organization, and instruction set of the Tensilica ConnX BBE64 family, a high-performance SIMD/VLIW digital signal processor built for 4G cellular systems.
Posted by Tensilica at 1:22 PM