tag:blogger.com,1999:blog-116046982024-03-12T18:51:21.271-07:00Tensilica NewsAll the news you're looking for from Tensilica, Inc. Find out how you can use Tensilica's customizable, extensible processors to speed your SOC design. See Tensilica for DSPs and all the processing you need to do in the dataplane (dataplane processors - DPUs).Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comBlogger690125tag:blogger.com,1999:blog-11604698.post-27294490290410646612013-10-15T08:51:00.003-07:002013-10-15T08:51:29.337-07:00New Cadence Partner offers Voice Processing for Tensilica HiFi Audio DSPsFortemedia's groundbreaking voice processing solution, iS600, is now available optimized for Cadence's Tensilica® HiFi DSPs. The iS600 high performance voice processing technology dramatically improves user experience in voice communication and voice recognition for smart phones. In the past, such performance was only available with a custom dedicated DSP that had enough devoted bandwidth and memory. With iS600, a superior solution can be available on a licensable DSP which is already integrated in many equipment including smartphones, tablets, Digital TV, STB, Blu-ray Disc players, Car Entertainment Systems and Lap Top/Desktop Computers. <a href="http://www.fortemedia.com/press/PR_131010.html" target="_blank">See the rest of their press release. </a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-69443145307676620672013-10-14T15:34:00.001-07:002013-10-14T15:34:08.600-07:00AMD's new True Audio features Cadence Tensilica HiFi Audio DSPs <a href="http://pixelrant.com/2013/10/08/everything-you-wanted-to-know-about-amds-new-trueaudio-technology/" target="_blank">Read the interview with AMD’s Carl Wakeland</a>. Wakeland is a Fellow Design Engineer and considered the “author” of TrueAudio. TrueAudio includes one HiFi EP and two HiFi 2 DSPs. <br />
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Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-19409738856172772782013-10-11T15:14:00.001-07:002013-10-11T15:14:04.664-07:00Cadence adds Dolby and DTS SW for Tensilica HiFi Audio DSPsCadence announced that it was the first company to offer an IP core solution supporting Dolby Digital Plus with DS1 and DTS Neural Surround.<br />
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The Dolby DS1 for Dolby Digital Plus is for applications in mobile devices such as handsets and tablets as well as any infotainment system with small speakers, like ultra-slim flat-panel TVs. Dolby DS1 for Digital Plus is optimized to provide mobile users with home theater-inspired sound quality by enabling a distortion-free audio/voice boost and also by compensating for unintelligible dialogue, extreme volume variation, and deficiencies inherent in the small speakers and low-power amplifiers on most mobile devices. <a href="http://www.tensilica.com/news/439/330/Cadence-Offers-Industry-s-First-Licensable-Audio-DSP-IP-Supporting-Dolby-Digital-Plus-with-DS1" target="_blank">See press release</a>.<br />
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DTS Neural Surround brings a home theater-like experience to automobiles and A/V receivers, significantly enhancing the sound quality of upmixing from compressed media types like MP3. Many recent sports and music broadcasts, including Rolling Stones concerts and the 2013 Super Bowl, were broadcast in DTS Neural Surround to ensure that fans received the highest level quality audio. <a href="http://www.tensilica.com/news/438/330/Cadence-Offers-Industry-s-First-IP-Core-Solution-Supporting-DTS-Neural-Surround" target="_blank">See press release</a>.Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-18078536231212349032013-09-17T08:08:00.002-07:002013-09-17T08:08:30.028-07:00Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica HiFi Audio/Voice DSP IP“Sound quality, performance and low power architecture are critical
contributors to our reputation and success with our leading customers,”
said Mark Tyndall, vice president of corporate development and strategy
at Dialog. “The Cadence Tensilica HiFi Audio/Voice DSP delivers in all
these areas and has a comprehensive software partner ecosystem, which is
essential for the connectivity and portable device markets we serve.”<br />
<a href="http://www.tensilica.com/news/437/330/Dialog-Semiconductor-Licenses-Cadence-s-Industry-Leading-Tensilica-HiFi-Audio-Voice-DSP-IP" target="_blank">Read more here.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-30092032136085190622013-08-30T13:35:00.002-07:002013-08-30T13:35:48.392-07:00Today's moving day! Tensilica employees are moving to the Cadence campusIt's work-from-home days while the trucks move our stuff over to the Cadence campus. Our new office address is 2655 Seely Avenue, Building 8, San Jose, CA 95134. The main phone number is 408-943-1234. And our Tensilica email addresses will still work, so you can easily get in touch with us. <br />
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<tr><td class="tr-caption" style="text-align: center;">Cadence's Building 10 - You can't miss it from Montague Expressway in San Jose</td><td class="tr-caption" style="text-align: center;">\</td><td class="tr-caption" style="text-align: center;"></td><td class="tr-caption" style="text-align: center;"></td><td class="tr-caption" style="text-align: center;"></td><td class="tr-caption" style="text-align: center;"><br /></td><td class="tr-caption" style="text-align: center;"><br /></td></tr>
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Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-81738450601785675582013-08-28T13:37:00.003-07:002013-08-28T13:37:59.711-07:00Renesas Licenses Cadence’s Tensilica ConnX D2 DSP for Next-Generation IoT Chip Combined with the special acceleration packages optimized for IoT wired and wireless modem standards, the ConnX D2 DSP was selected because it met the low-power, small-size and high-performance requirements for Renesas’ new chip, with extra headroom for future standards. The acceleration packages enable a 10X power/performance improvement over the standard ConnX D2 performance.<br />
<a href="http://www.tensilica.com/news/436/330/Renesas-Licenses-Cadence-s-Tensilica-ConnX-D2-DSP-for-Next-Generation-IoT-Chip" target="_blank">Read press release</a>.Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-4497478072089164462013-08-06T06:45:00.002-07:002013-08-06T06:45:13.787-07:00MStar Licenses Tensilica IP Core from Cadence“By leveraging the capabilities of the Xtensa DPU, we were able to
better optimize our design for higher efficiency,” stated WK Chia, Vice
President of Research and Development, MStar. “As a result, we were able
to further enhance our home entertainment platform and provide our
customers with more cost-efficient solutions.”<br />
Read the <a href="http://www.tensilica.com/news/434/330/MStar-Licenses-Tensilica-IP-Core-from-Cadence" target="_blank">press release</a>.Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-65511204256361598912013-07-12T16:45:00.002-07:002013-07-12T16:45:14.727-07:00Cadence Tensilica DPU Featured in new GEO Semiconductor Geometric Processing IC for Ultra-Wide Angle Cameras and Pico Projector Based Heads-Up displays"The GW3300 integrates GEO’s patented eWARP® core and a Tensilica® CPU with parallel and MIPI interfaces on both inputs and outputs. The GW3300’s fully programmable geometry processing engine can correct for complex lens distortion, perspective and rotational misalignment, as well as brightness nonuniformityin real time with as low as 1/6 frame of latency." See <a href="http://geosemi.com/wp-content/themes/geo2013/pdf/130711_GEO_Introduces_New_Geometric_Processing_IC.pdf" target="_blank">GEO's press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-66963586403236874362013-06-27T09:41:00.001-07:002013-06-27T09:41:14.507-07:00Cadence First to Demo Complete M-PCIe PHY and Controller Solution at MIPI and PCI-SIG Conferences <div>
One of the hottest (or should I say coolest – because low power is so
important) new standards is PCI Express® (PCIe) over M-PHY, or <a href="http://www.pcisig.com/news_room/Press_Releases/June_25_2013/" target="_blank">M-PCIe</a>. To implement it properly, it’s essential that the
controller and PHY work well together as the interface specification between
them is, to put it mildly, loosely defined. </div>
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Our booth was jammed at the PCI-SIG conference, and our demo of a complete PHY and controller for mobile PCI Express was very impressive. Find out more on <a href="http://www.cadence.com/Community/blogs/ip/archive/2013/06/27/cadence-first-to-demo-complete-m-pcie-phy-and-controller-solution-at-mipi-and-pci-sig-conferences.aspx" target="_blank">the Cadence blog</a>.<br />
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<a href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgdvfpY6W9H7pABRwGFJZeQvzU4m3QuoeviiaSrKZdmHF5iMYduEXFzw3pKPPQVUV7oQvu6QzzZaToSyuM_ihwbm8u5JK7sBLhokUTNvVAiTBfSCaOHg82HO885bsIsEqPLnUobwQ/s1024/mpcie.jpg" imageanchor="1" style="margin-left: 1em; margin-right: 1em;"><img border="0" height="240" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgdvfpY6W9H7pABRwGFJZeQvzU4m3QuoeviiaSrKZdmHF5iMYduEXFzw3pKPPQVUV7oQvu6QzzZaToSyuM_ihwbm8u5JK7sBLhokUTNvVAiTBfSCaOHg82HO885bsIsEqPLnUobwQ/s1024/mpcie.jpg" width="320" /></a></div>
<br />Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-24647826533058028622013-06-17T11:15:00.004-07:002013-06-17T11:15:28.254-07:00What Cadence's Acquisition of Evatronix Brings to the IP PartyCadence's expanding IP portfolio now includes Evatronix. They bring some great IP products to the Cadence mix, including USB solutions, NAND Flash IP, SD Host 4.0, MIPI SLIMbus IP, and an 8051 controller. Find out more by<a href="http://www.cadence.com/Community/blogs/ii/archive/2013/06/17/what-the-evatronix-ip-acquisition-brings-to-cadence.aspx" target="_blank"> reading this blog</a>.Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-90425518386275950102013-06-11T06:24:00.003-07:002013-06-11T06:24:39.937-07:00Cadence Fellow and Ex Tensilica Founder and CTO Chris Rowen Interviewed about Cadence Acquisition by New Electronics"He describes the acquisition by Cadence as a watershed advance in the eda and IP
business. It is, he believes 'unique in the industry', meshing as it does
Tensilica's strengths in assessing a design's system architecture, the
functionality, the algorithms needed to run in silicon to accomplish a
particular task and how to put all of that together with Cadence's interconnect
blocks, design and verification interactions to build the pieces." <a href="http://www.newelectronics.co.uk/electronics-interviews/interview-with-dr-chris-rowen-tensilica/51881/" target="_blank">Read entire interview here.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-37914087492566784322013-05-31T07:55:00.000-07:002013-05-31T07:55:04.253-07:00See Tensilica in the Cadence Booth at DAC Next Week in AustinChris Rowen will be presenting "Goldilocks and the Three Bears of Programmability" in a <a href="http://www.dac.com/conference+program+special+sessions.aspx?event=471&topic=17" target="_blank">DAC special session Tuesday 10:30-12</a>. <br />
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Steve Roddy will be presenting our new IVP Image/Video processor and Customizable Processor Basics in the Cadence Theater.<br />
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And I'll be working the booth near the IP stand. Stop by to play our cool game and win a Samsung tablet or Apple TV. There's a prize for everyone who stops by.<br />
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See you there!Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-48031429685144336802013-05-28T19:33:00.001-07:002013-05-28T19:33:26.922-07:00See Cadence Fellow Chris Rowen's Presentation on the Tensilica IVP Image/Video ProcessorDid you miss Chris' presentation at the Embedded Vision Summit? It's up <a href="http://www.embedded-vision.com/platinum-members/tensilica/embedded-vision-training/videos/pages/april-2013-embedded-vision-summit" target="_blank">on YouTube now</a> and you can learn about Porting Applications to High-Performance Imaging DSPs.<br />
<br />Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-45697526520216168812013-04-30T22:46:00.001-07:002013-04-30T22:46:25.326-07:00See the Tensilica booth at ChipEx 2013 in Israel<div class="separator" style="clear: both; text-align: center;">
<a href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEh7WDwHP1uW_ZJsoByW3Um0Tnp-7SdoEFSfSig_DU3D2eyggRA3pNRDZoYoIBkkhaA3kpv8IjBnDrcxtgrQiu1l_Yn5-YqcywmvnyTK4Bv2iqJ0JUl63kbVtYjtkIHCtIsYC_Hp9Q/s1600/chipex_2013.jpg" imageanchor="1" style="margin-left: 1em; margin-right: 1em;"><img border="0" height="240" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEh7WDwHP1uW_ZJsoByW3Um0Tnp-7SdoEFSfSig_DU3D2eyggRA3pNRDZoYoIBkkhaA3kpv8IjBnDrcxtgrQiu1l_Yn5-YqcywmvnyTK4Bv2iqJ0JUl63kbVtYjtkIHCtIsYC_Hp9Q/s1600/chipex_2013.jpg" width="320" /></a></div>
<br />Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-57799141375570388532013-04-24T20:28:00.004-07:002013-04-24T20:28:57.334-07:00Cadence Completes Acquisition of TensilicaFrom Cadence's press release:<br />
"<span id="ctl00_ctl13_g_8b6bcb0f_c7b7_4d0e_8c5a_36cd4cc0a621_ctl00_output_content">Cadence
this week completed its previously announced acquisition of Tensilica,
Inc., a leader in dataplane processing IP. The cash outlay at closing,
after taking into account adjustments for certain costs and an estimated
$25 million of cash held by Tensilica at closing, was approximately
$326 million. In addition, Cadence assumed certain unvested Tensilica
options. Tensilica's configurable dataplane processing units complement
industry-standard processor architectures and are optimized for embedded
data and signal processing. Tensilica's target markets include mobile
wireless, network infrastructure, auto infotainment and home
applications. The Tensilica team, led by Jack Guedj, will report to
Martin Lund, Cadence's senior vice president of research and
development, SOC Realization Group."</span><br />
<a href="http://www.cadence.com/cadence/newsroom/press_releases/Pages/pr.aspx?xml=042413_financial&CMP=home" target="_blank">See press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-80624608860689417532013-04-18T14:40:00.004-07:002013-04-18T14:40:38.181-07:00ComplexIQ Partners with Tensilica for Multimedia over Coax (MoCA) Network InterfaceMoCA is becoming the standard for home entertainment networking,
including multi-room DVR (digital video recorder), personal content
sharing, OTT (over the top) content sharing and IPTV (Internet Protocol
Television) applications. Cable, satellite and IPTV suppliers use the
MoCA interface to provide multiple streams of HD video, delivering high
throughput and high quality service. <br />
<a href="http://www.tensilica.com/news/431/330/ComplexIQ-Partners-with-Tensilica-for-Multimedia-over-Coax-MoCA-Network-Interface" target="_blank">See press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-50331026144872857832013-04-09T14:38:00.002-07:002013-04-09T14:38:33.631-07:00Inomize Becomes Newest Tensilica Design Center in Israel“We’re excited to work closely with Tensilica, who is creating a major
presence in Israel for many signal processing designs,” stated Udi
Shaked, CEO, Inomize. “Tensilica’s ConnX communications DSPs and HiFi
audio/voice DSPs are ideal for many companies in Israel doing digital
signal processing. Instead of using inflexible, legacy, off-the-shelf
DSPs, Tensilica’s customers can customize cores for their exact
specifications, letting them run at the lowest power and area while
achieving higher performance. That level of customization is essential
for the highly innovative customer base that we serve here in Israel.” <a href="http://www.tensilica.com/news/430/330/Inomize-Becomes-Newest-Tensilica-Design-Center-in-Israel" target="_blank">See press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-49835084280566694972013-03-25T11:08:00.005-07:002013-03-25T11:08:57.761-07:00Algotochip is Tensilica's Newest Design Center PartnerAlgotochip’s patented approach can speed hardware and software design
for SOCs in as little as eight weeks. Algotochip
guarantees that its SOC meets all the performance specifications made by
the customers, and insures that it will be right the first time. <a href="http://www.tensilica.com/news/429/330/Algotochip-Becomes-Tensilica-Design-Center-Partner" target="_blank">See press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-2164562632776539242013-03-22T11:07:00.003-07:002013-03-22T11:07:19.695-07:00Tensilica Joins HSA Foundation to Help Establish Standards for Embedded Heterogeneous Computing Tensilica has joined the HSA
(Heterogeneous System Architecture) Foundation, a not-for-profit
consortium dedicated to developing architecture specifications that will
unlock the performance and power efficiency of parallel computing
engines found in many modern devices. Tensilica will contribute its
years of experience assisting customers in bringing heterogeneous
multicore SoC designs to market to the development and
promotion of standards for parallel computing. <br />
<a href="http://www.tensilica.com/news/428/330/Tensilica-Joins-HSA-Foundation-to-Help-Establish-Standards-for-Embedded-Heterogeneous-Computing" target="_blank">Read press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-83859102124427370102013-03-13T09:09:00.001-07:002013-03-13T09:09:06.827-07:00Insightful Article on Cadence Acquisition of Tensilica"With the existing licensing deals that Tensilica has, Cadence can
augment its IP offering. But, potentially, the combination of design
tools, in an era where software design is becoming more critical, and
the configurable processor concept could bring the sea-of-processors
architecture, and the advantages it may bring, just that little bit
closer."<br />
<a href="http://www.techdesignforums.com/blog/2013/03/12/eda-sea-of-processors-tensilica/" target="_blank">Read entire article.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-88896578249222928272013-03-12T15:02:00.001-07:002013-03-12T15:03:30.158-07:00Cadence to Acquire Tensilica “With Tensilica, we will be able to provide designers with a more
complete SoC solution that will speed the development of innovative and
differentiated products, while reducing time to market,” said Lip-Bu
Tan, president and chief executive officer of Cadence. “We look forward
to working with Tensilica’s dedicated employees as one team to bring
even more value to our customers.”<br />
<a href="http://www.tensilica.com/news/427/330/Cadence-to-Acquire-Tensilica" target="_blank">See press release.</a> Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-72732382625327528492013-03-08T09:00:00.001-08:002013-03-08T09:00:21.449-08:00MegaChips Completes Design Center Agreement with Tensilica to Enhance R&D and Expand Marketing Collaboration<span style="-webkit-text-size-adjust: auto; -webkit-text-stroke-width: 0px; color: #333333; display: inline !important; float: none; font-family: Verdana, Arial, Geneva, Helvetica, sans-serif; font-size: 12px; font-style: normal; font-variant: normal; font-weight: normal; letter-spacing: normal; line-height: 19.1875px; orphans: auto; text-align: left; text-indent: 0px; text-transform: none; white-space: normal; widows: auto; word-spacing: 0px;">“Our partnership with Tensilica enables us to procure Tensilica’s outstanding IP cores with ease and accelerate advanced SoC development,” said Gen Sasaki, director, officer and general manager of Division No. 2 at MegaChips. “This lets us deliver superior LSI products with shorter lead times to both domestic and international customers who constantly seek advanced functions.”</span><br />
See <a href="http://www.tensilica.com/news/426/330/MegaChips-Completes-Design-Center-Agreement-with-Tensilica-to-Enhance-R-D-and-Expand-Marketing-Collaboration" target="_blank">press release</a>.Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-26057197025823816822013-02-26T20:46:00.001-08:002013-02-26T20:46:14.254-08:00Tensilica's Gathering Huge Crowds at MWC 2013<div class="separator" style="clear: both; text-align: center;">
<a href="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiXCLpcMmBwt9lly7I0Ko2RKz6qinBWBcNOzDT9_OBm9mBeVKb7jZZjNc-DVCRPraCMM-6CP6F-j1XJ7rTKqzTaBPMH_CvWnLwDwXKig3D7eGdYbn1VqlSWkwsCpjLO8CJS6-amqA/s1600/booth_small.jpg" imageanchor="1" style="margin-left: 1em; margin-right: 1em;"><img border="0" height="240" src="https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEiXCLpcMmBwt9lly7I0Ko2RKz6qinBWBcNOzDT9_OBm9mBeVKb7jZZjNc-DVCRPraCMM-6CP6F-j1XJ7rTKqzTaBPMH_CvWnLwDwXKig3D7eGdYbn1VqlSWkwsCpjLO8CJS6-amqA/s1600/booth_small.jpg" width="320" /></a></div>
We're getting ready to start day 3 at Mobile World Congress. I took this picture during a slow time yesterday. Our booth in Hall 6, stand D101, has three conference rooms, lots of good demos, and strong crowds. If you're at MWC, be sure to stop by to see:<br />
- Our new imaging demos - image stabilization and HDR capture<br />
- Our complete LTE downlink demo<br />
- As many audio demos as we could fit (we have so many now with strong partners like Sensory and Acoustic Technologies working in our booth)<br />
- The display case full of the latest Smartphones and tablets that include Tensilica cores.<br />
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<br />Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-85766499353991754322013-02-26T20:40:00.001-08:002013-02-26T20:40:34.344-08:00Tensilica and Sensory Drive Industry’s Lowest Power DSP-Based Voice Activation SolutionBy utilizing Sensory’s Low Power Speech Detection technology, Tensilica
was able to further reduce power to an average of under 25 µW when
implemented in a 28 nm HPL process, the lowest power implementation by
far in the industry. This makes this joint solution ideal for always-on
voice activated smartphones, tablets, appliances and automotive
applications.<br />
<a href="http://www.tensilica.com/news/424/330/Tensilica-and-Sensory-Drive-Industry-s-Lowest-Power-DSP-Based-Voice-Activation-Solution" target="_blank">See press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.comtag:blogger.com,1999:blog-11604698.post-79753366359914474012013-02-26T11:54:00.002-08:002013-02-26T11:54:47.562-08:00Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products“For more than four years, we have worked very closely with Tensilica on
a number of projects,” stated Teresa He, vice president of HiSilicon.
“We have found that Tensilica’s DPUs can help us differentiate our
products and achieve competitive advantages in terms of power,
performance, and area. Tensilica cores have operated as expected and
their support has been superb, enabling us to significantly speed up our
development time. We are very pleased to strengthen our relationship
with this agreement.”<br />
<a href="http://www.tensilica.com/news/423/330/Tensilica-and-Huawei-Expand-Strategic-Relationship-for-Next-Generation-Products" target="_blank">See press release.</a>Tensilicahttp://www.blogger.com/profile/04327060126076544453noreply@blogger.com