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Friday, June 06, 2008

Imperas Announces Licensing, Distribution Relationship with Tensilica

Tensilica has signed a partnership agreement with Imperas to allow fast functional, instruction accurate models of its popular Xtensa and Diamond Standard processors to run on Open Virtual Platform (OVP) based virtual platforms. Specifically, wrapper files enabling integration of the Tensilica processor models are now available for free download from the website. These models will run with Tensilica’s TurboXim fast functional simulator, which simulates at speeds 40 to 80 times faster than a traditional instruction set simulator.

For more information, see

Tensilica and SPIRIT DSP Partner for Mobile Multimedia Audio and Voice

SPIRIT DSP, the world’s leading supplier of voice, audio and video software engines, and Tensilica, Inc. today announced that they have formed a strategic partnership and can now deliver 18 optimized, high quality digital audio and voice software packages that run on Tensilica’s HiFi 2 Audio Engine, an increasingly popular audio architecture for system-on-chip (SOC) designs.

Immediately available, SPIRIT audio software packages include: AAC-LC decode and encode, aacPlus v1 and v2 decode and encode, BSAC decode, MP3 decode and encode, Ogg Vorbis decode, and WMA decode and encode. Voice codecs include AMR-NB (narrowband), AMR-WB and G.729AB.

For more information, see

New Open Source Linux Program

Tensilica, Inc. today announced that Embedded Linux 2.6 and GNU tools based on GCC 4.2, both available at, is now backed by two well-respected Linux industry partners.

Embedded Alley Solutions, Inc. of San Jose, CA, provides Platform Optimized Linux Solutions, Linux consulting services and training. Timesys, of Pittsburgh, PA, is providing subscriptions to LinuxLink for Tensilica customers to access embedded software, tools, documentation, and support and Timestorm: an Eclipse-based IDE that provides a point-and-click interface for kernel and root filesystem configuration, profiling, testing, and debugging.