Tensilica Showcases #1 Position in LTE DSP IP Cores at MWC 2011

Tensilica, Inc. will stand out at this year's Mobile World Congress (MWC) in Barcelona, February 14-18, 2011, as it has moved into the number one position as the supplier of baseband DSP IP cores for the new generation of 4G LTE equipment. Eight of the top 15 LTE chipset manufacturers are working with Tensilica's cores for their designs.

 "Tensilica has jumped to the number one position in baseband DSP IP cores for LTE because they provide the widest range of solutions for mobile handsets and wireless basestations. They've been able to get these products to market quickly by utilizing their customizable DPU technology," stated Will Strauss, president of Forward Concepts and leading DSP analyst. "And the new BBE64 DSP family they're introducing today will be a major step forward to meet the even greater needs of LTE Advanced."