Stanford University’s Smart Memories Project used Tensilica’s Xtensa LX2 configurable processor to develop a multiprocessor computing infrastructure for next generation applications. The Stanford Smart Memories Project has developed a prototype system-on-chip (SOC) design that provides the user the ability to program both the processor and the memory system of a chip-level multiprocessor. Using Tensilica allowed the Smart Memory team to focus on creating a flexible memory system that supports many different memory models, including message passing, coherent shared memory, and transactional memory. The design is currently being evaluated for possible commercial deployment by a couple of large semiconductor companies.
For more information, see http://www.tensilica.com/news_events/pr_2008_02_28.htm
Thursday, February 28, 2008
Tuesday, February 26, 2008
SandForce Licenses Tensilica’s Diamond Standard 108Mini for Storage Controller Chipsets
SandForce, Inclicensed the Diamond Standard 108Mini RISC controller core to use in their high-performance storage controller chipset designs.
“We needed a basic, low-cost, small controller, and the Diamond Standard 108Mini perfectly fit our requirements,” stated Alex Naqvi, CEO, SandForce.
For more information, see http://www.tensilica.com/news_events/pr_2008_02_26.htm
“We needed a basic, low-cost, small controller, and the Diamond Standard 108Mini perfectly fit our requirements,” stated Alex Naqvi, CEO, SandForce.
For more information, see http://www.tensilica.com/news_events/pr_2008_02_26.htm
Tuesday, February 19, 2008
Samsung Signs Multi-Year License for Tensilica Diamond Standard 330HiFi Audio DSP
Samsung Electronics Co., Ltd. has signed a broad multi-year license for Tensilica’s Diamond Standard 330HiFi audio DSP (digital signal processor). Tensilica’s HiFi architecture is the most popular commercial audio core for system-on-chip (SOC) designs. Samsung will use the Diamond Standard 330HiFi audio DSP in mobile handset and other designs.
“Tensilica’s HiFi 2 audio DSP architecture is a widely adopted, advanced DSP core with over 30 voice and audio encoder and decoder software packages readily available,” stated G. S. Han, vice president of Samsung Electronics, System LSI Division. “After a thorough technical evaluation of Tensilica’s HiFi offering, we found that the Diamond 330HiFi was the right audio DSP for Samsung and will be a key DSP in our IP portfolio for years to come.”
For more information, see http://www.tensilica.com/news_events/pr_2008_02_14.htm
“Tensilica’s HiFi 2 audio DSP architecture is a widely adopted, advanced DSP core with over 30 voice and audio encoder and decoder software packages readily available,” stated G. S. Han, vice president of Samsung Electronics, System LSI Division. “After a thorough technical evaluation of Tensilica’s HiFi offering, we found that the Diamond 330HiFi was the right audio DSP for Samsung and will be a key DSP in our IP portfolio for years to come.”
For more information, see http://www.tensilica.com/news_events/pr_2008_02_14.htm
Tuesday, January 08, 2008
Microprocessor Report comments on the Future of Multicore Processors
Tom Halfhill's editorial on The Future of Multicore Processors is right on the mark. You can read it at http://www.tensilica.com/pdf/Multicore_Microprocessor_Rept.pdf
Monday, January 07, 2008
Innovative Tensilica-Based Products on Display at CES 2008
Over 30 companies that either license Tensilica’s popular processor cores or use merchant market semiconductor products that include Tensilica’s cores will be displaying products at this week’s International Consumer Electronics Show (CES). These Tensilica-enabled products include some of the most advanced, innovative consumer devices, including LCD TVs, cellular phones, WiFi-enabled notebook computers, inkjet and laser printers.
The list of exhibitors at CES that either license Tensilica’s Xtensa configurable or Diamond Standard processor cores or use Tensilica-powered silicon products includes: AMD, Atheros Communications, Belkin, Broadcom, Cisco, Cypress Semiconductor, Dell, D-Link Systems, Epson, Fujitsu, Hewlett Packard, iBiquity Digital, Intel, JVC, Lenovo, LG Electronics, Marvell, Mediaphy, Mitsubishi, Motorola, NEC Electronics, NTT Electronics, NVIDIA, Olevia, Olympus, Panasonic, Samsung, Sony, Validity Sensors, and XM Radio.
The list of exhibitors at CES that either license Tensilica’s Xtensa configurable or Diamond Standard processor cores or use Tensilica-powered silicon products includes: AMD, Atheros Communications, Belkin, Broadcom, Cisco, Cypress Semiconductor, Dell, D-Link Systems, Epson, Fujitsu, Hewlett Packard, iBiquity Digital, Intel, JVC, Lenovo, LG Electronics, Marvell, Mediaphy, Mitsubishi, Motorola, NEC Electronics, NTT Electronics, NVIDIA, Olevia, Olympus, Panasonic, Samsung, Sony, Validity Sensors, and XM Radio.
Some of the most innovative solutions on display that include Tensilica processors include:
- AMD uses Tensilica’s processors for audio and video functions in the Imageon family of Media Processors, which are used in mobile phones from Cingular, Motorola, Panasonic and Samsung; and ATI Radeon graphics chips with Avivo-HD UVD technology.
- Epson uses multiple Tensilica processors for the entire image processing engine in its latest inkjet photo printer lines.
- HP uses Tensilica processors in its popular low-cost Laserjet product line.
- LG Electronics uses Tensilica’s processors in their mobile phones for the Korean T-DMB and European DVB-H television services.
- NVIDIA uses Tensilica processors in high-performance graphics cards and chips for cellular phones.
- Samsung’s HD Radio chip set, which is based on a Tensilica processor core, will be displayed at the iBiquity booth.
- Syntax Olevia 7 Series 1080p 42" and 47" LCD TV displays and the 65” Olevia 265TFHD LCD TV feature the integrated Realta HQV video processing engine from Silicon Optix, a Tensilica licensee.
Other products from CES vendors using the Silicon Optix HQV chip include:
- Yamaha DPX-1300 high-performance digital video projector
- Mitsubishi HC5000BL 1080p LCD projector
- Samsung Blu-Ray DVD Player
Tensilica-based chips provide the wireless USB functions for notebooks from Dell, Lenovo and Toshiba as well as the wireless USB hubs and adapters from Belkin and D-Link.
Tensilica will be hosting meetings in its suites at the Venetian Hotel at CES. To schedule a meeting, please contact Toni Garza at toni@tensilica.com.
Thursday, December 20, 2007
New Dolby Digital Consumer Encoder and Dolby Digital Compatible Output 5.1-Channel Encoders
Tensilica has added the Dolby Digital Consumer Encoder (DDCE) and Dolby Digital Compatible Output (DDCO) 5.1-channel encoders to its audio codec library for the Xtensa HiFi 2 Audio Engine, one of the most popular commercial audio cores for system-on-chip (SOC) designs. These encoders enable manufacturers to design consumer devices, including Blu-ray Disc players, HD DVD players, portable devices and camcorders, which support Dolby 5.1-channel surround sound as well as next-generation high-definition (HD) video technologies.
For more information, see http://www.tensilica.com/news_events/pr_2007_12_18.htm
For more information, see http://www.tensilica.com/news_events/pr_2007_12_18.htm
Thursday, December 13, 2007
Tensilica Enhances Xtensa Configurable Processor Families
Tensilica has upgraded its two Xtensa configurable processor families (the Xtensa 7 and Xtensa LX2) with new hardware options and software tool enhancements that make it appeal to an even wider audience of SOC (system-on-chip) designers. Highlights of these capabilities include a new, smaller general purpose register file option, new integer multiplier and divider execution unit options, two new AMBA (Advanced Microcontroller Bus Architecture 3.0) bridge options, as well as an easy-to-use new configuration tool that analyzes source C/C++ code and automatically suggests VLIW (very long instruction word) instruction extensions that lead to 30-60 percent improvements in general purpose code performance.
These new capabilities provide designers with the most productive configurable processor design environment, with automated features that ensure each processor design is correct by construction. For more information, see http://www.tensilica.com/news_events/pr_2007_12_10_xtensa.htm
These new capabilities provide designers with the most productive configurable processor design environment, with automated features that ensure each processor design is correct by construction. For more information, see http://www.tensilica.com/news_events/pr_2007_12_10_xtensa.htm
New Integrated Real-Time Trace Support
Tensilica has added an optional full-speed, non-intrusive instruction trace capability to all of its Diamond Standard and Xtensa configurable processor cores. Tensilica’s TRAX-PC processor trace capture macrocell is Nexus 5001 compatible and ideal for debugging complex, challenging real-time applications such as engine and motor control. Software control and use of the on-chip TRAX hardware is fully integrated into Tensilica’s Xplorer integrated design environment (IDE) so software engineers can easily develop and debug programs while using the TRAX-PC trace macrocell.
For more information, see http://www.tensilica.com/news_events/pr_2007_12_10_trax.htm
For more information, see http://www.tensilica.com/news_events/pr_2007_12_10_trax.htm
Wednesday, December 05, 2007
NEC Electronics America Offers Free License for Tensilica's Diamond Standard 106Micro Processor Core
NEC Electronics America, Inc. will offer a free license for Tensilica's Diamond Standard 106Micro processor core used in NEC Electronics gate arrays to attendees of a co-sponsored webcast seminar with Tensilica, Inc. This offer, valued from $25,000 to $75,000, is valid through March 31, 2008, upon receipt of a signed purchase order.
To join the webcast, go to:https://event.on24.com/eventRegistration/EventLobbyServlet?target=registration.jsp&eventid=97638&sessionid=1&key=F68674417431BD07F49139A0A29B605B&partnerref =evite1&sourcepage=register. For those unable to attend the livewebcast, it will be available on demand for one year.
To join the webcast, go to:https://event.on24.com/eventRegistration/EventLobbyServlet?target=registration.jsp&eventid=97638&sessionid=1&key=F68674417431BD07F49139A0A29B605B&partnerref =evite1&sourcepage=register. For those unable to attend the livewebcast, it will be available on demand for one year.
Monday, December 03, 2007
Express Logic Introduces ThreadX RTOS Support for Diamond Standard 106Micro
Express Logic announced ThreadX RTOS and middleware support for Tensilica’s new Diamond Standard 106Micro 32-bit microcontroller core. ThreadX supports the entire line of Tensilica’s Xtensa configurable cores, and its Diamond Standard series of preconfigured cores. The addition of the 106Micro continues ThreadX support for the complete Tensilica processor family.
ThreadX is Express Logic’s small, fast, royalty-free RTOS for demanding real-time applications. Its royalty-free business model makes ThreadX extremely attractive for high-volume devices. ThreadX’s ease-of-use enables ThreadX-powered devices to get to market on time and within budget, which accounts for ThreadX’s success in the marketplace and its high-volume implementations. ThreadX has been widely embraced and is currently deployed in excess of 450 million electronic products. ThreadX is complemented by Express Logic’s NetX TCP/IP stack, FileX file system, USBX USB stack, and PEGX GUI development kit, all of which also are available for Tensilica’s new Diamond Standard 106Micro.
For more information, see http://www.tensilica.com/news_events/pr_2007_12_3.htm
ThreadX is Express Logic’s small, fast, royalty-free RTOS for demanding real-time applications. Its royalty-free business model makes ThreadX extremely attractive for high-volume devices. ThreadX’s ease-of-use enables ThreadX-powered devices to get to market on time and within budget, which accounts for ThreadX’s success in the marketplace and its high-volume implementations. ThreadX has been widely embraced and is currently deployed in excess of 450 million electronic products. ThreadX is complemented by Express Logic’s NetX TCP/IP stack, FileX file system, USBX USB stack, and PEGX GUI development kit, all of which also are available for Tensilica’s new Diamond Standard 106Micro.
For more information, see http://www.tensilica.com/news_events/pr_2007_12_3.htm
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