“We are very excited to showcase at MWC all of the smartphones and
tablets that are using Tensilica for audio/voice, Bluetooth, WiFi and
LTE baseband processing,” stated Jack Guedj, Tensilica’s president and
CEO. “And with our latest imaging/video DSP (see press release), Tensilica is well positioned to expand our lead as the largest DSP IP supplier.”
See press release.
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2013
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February
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- Tensilica's Gathering Huge Crowds at MWC 2013
- Tensilica and Sensory Drive Industry’s Lowest Powe...
- Tensilica and Huawei Expand Strategic Relationship...
- SimpLight Achieves First LTE Modem Silicon Success...
- Tensilica to Showcase Complete IP Solutions for Vi...
- Tensilica to Demonstrate Fujitsu Smartphone that U...
- Sensory’s New TrulyHandsfree 3.0 Speaker Verificat...
- New mimoOn Library for Tensilica’s Baseband DSP IP...
- Acoustic Technologies Wideband HD Voice Processing...
- NXP HD Voice Processing Smartphone SW Now Availabl...
- Tensilica's New IVP Imaging/Video DSP Ideal for Mo...
- Phison Uses Tensilica for NAND Flash Memory Contro...
- TU Dresden Innovates with Tensilica's Xtensa LX4
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February
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- Tensilica
- I'm the director of corporate communications at Tensilica. I really believe in our technology and just want to show engineers just how productive they can be with our automated tools.