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Tuesday, February 26, 2013

Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products

“For more than four years, we have worked very closely with Tensilica on a number of projects,” stated Teresa He, vice president of HiSilicon. “We have found that Tensilica’s DPUs can help us differentiate our products and achieve competitive advantages in terms of power, performance, and area. Tensilica cores have operated as expected and their support has been superb, enabling us to significantly speed up our development time. We are very pleased to strengthen our relationship with this agreement.”
See press release.