"We conducted a thorough review and evaluation of licensable DSP IP cores before selecting Tensilica," stated Teresa He, Vice President of HiSilicon. "Tensilica's unique ability to combine world-class DSP capability with the flexibility and customization of the Xtensa DPUs gives HiSilicon the opportunity to strongly differentiate our products. We feel this will give us a strong competitive advantage."
Tuesday, February 09, 2010
HiSilicon, a division of Huawei, Licenses Tensilica's Xtensa Dataplane Processors and ConnX DSPs
HiSilicon will use Tensilica's DPUs and DSPs in network equipment chip design.
