“We recognize the growing importance of Tensilica’s customizable DPUs for semiconductors that enable lower power and innovative mobile devices, and that’s why we made this investment,” stated Tomoya Hemmi, president and CEO, DOCOMO Capital. “Tensilica’s high-performance DPUs for audio, video and baseband functions will be key enablers for new capabilities and increased battery life in future mobile telephones.”
For more information, see http://www.tensilica.com/news/288/330/Tensilica-Announces-Strategic-Investment-by-DOCOMO-Capital.htm
