SiBEAM, Inc., a leading innovator of millimeter wave (mmWave) solutions and developer of high-speed wireless communications platforms, has selected Tensilica’s Xtensa configurable processor for an upcoming chip design project.for baseband DSP.
“SiBEAM has developed its wireless communications products to deliver high quality wireless video solutions for consumer electronics and display applications. These applications demand high data rate transmission to multiple devices within an indoor wireless environment using conventional CMOS silicon,” said Kumar Mahesh, manager of MAC and Software Design for SiBEAM, Inc. “We selected Tensilica’s Xtensa processor for its ability to help us achieve our goal of developing innovative-multi-gigabit, lower-power mmWave communications products. By optimizing the Xtensa processor into a tailored processor core, this enables our products to attain the performance these wireless applications demand.”
For more information, see http://www.tensilica.com/news_events/pr_2007_08_20.htm
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