See the Tensilica booth at ChipEx 2013 in Israel

Cadence Completes Acquisition of Tensilica

From Cadence's press release:
"Cadence this week completed its previously announced acquisition of Tensilica, Inc., a leader in dataplane processing IP. The cash outlay at closing, after taking into account adjustments for certain costs and an estimated $25 million of cash held by Tensilica at closing, was approximately $326 million. In addition, Cadence assumed certain unvested Tensilica options. Tensilica's configurable dataplane processing units complement industry-standard processor architectures and are optimized for embedded data and signal processing. Tensilica's target markets include mobile wireless, network infrastructure, auto infotainment and home applications. The Tensilica team, led by Jack Guedj, will report to Martin Lund, Cadence's senior vice president of research and development, SOC Realization Group."
See press release.

ComplexIQ Partners with Tensilica for Multimedia over Coax (MoCA) Network Interface

MoCA is becoming the standard for home entertainment networking, including multi-room DVR (digital video recorder), personal content sharing, OTT (over the top) content sharing and IPTV (Internet Protocol Television) applications. Cable, satellite and IPTV suppliers use the MoCA interface to provide multiple streams of HD video, delivering high throughput and high quality service.
See press release.

Inomize Becomes Newest Tensilica Design Center in Israel

“We’re excited to work closely with Tensilica, who is creating a major presence in Israel for many signal processing designs,” stated Udi Shaked, CEO, Inomize. “Tensilica’s ConnX communications DSPs and HiFi audio/voice DSPs are ideal for many companies in Israel doing digital signal processing. Instead of using inflexible, legacy, off-the-shelf DSPs, Tensilica’s customers can customize cores for their exact specifications, letting them run at the lowest power and area while achieving higher performance.  That level of customization is essential for the highly innovative customer base that we serve here in Israel.”  See press release.

Algotochip is Tensilica's Newest Design Center Partner

Algotochip’s patented approach can speed hardware and software design for SOCs in as little as eight weeks. Algotochip guarantees that its SOC meets all the performance specifications made by the customers, and insures that it will be right the first time. See press release.

Tensilica Joins HSA Foundation to Help Establish Standards for Embedded Heterogeneous Computing

Tensilica has joined the HSA (Heterogeneous System Architecture) Foundation, a not-for-profit consortium dedicated to developing architecture specifications that will unlock the performance and power efficiency of parallel computing engines found in many modern devices. Tensilica will contribute its years of experience assisting customers in bringing heterogeneous multicore SoC  designs to market to the development and promotion of standards for parallel computing.
Read press release.

Insightful Article on Cadence Acquisition of Tensilica

"With the existing licensing deals that Tensilica has, Cadence can augment its IP offering. But, potentially, the combination of design tools, in an era where software design is becoming more critical, and the configurable processor concept could bring the sea-of-processors architecture, and the advantages it may bring, just that little bit closer."
Read entire article.

Cadence to Acquire Tensilica

 “With Tensilica, we will be able to provide designers with a more complete SoC solution that will speed the development of innovative and differentiated products, while reducing time to market,” said Lip-Bu Tan, president and chief executive officer of Cadence. “We look forward to working with Tensilica’s dedicated employees as one team to bring even more value to our customers.”
See press release.

MegaChips Completes Design Center Agreement with Tensilica to Enhance R&D and Expand Marketing Collaboration

“Our partnership with Tensilica enables us to procure Tensilica’s outstanding IP cores with ease and accelerate advanced SoC development,” said Gen Sasaki, director, officer and general manager of Division No. 2 at MegaChips. “This lets us deliver superior LSI products with shorter lead times to both domestic and international customers who constantly seek advanced functions.”
See press release.

Tensilica's Gathering Huge Crowds at MWC 2013

We're getting ready to start day 3 at Mobile World Congress. I took this picture during a slow time yesterday. Our booth in Hall 6, stand D101, has three conference rooms, lots of good demos, and strong crowds.  If you're at MWC, be sure to stop by to see:
- Our new imaging demos - image stabilization and HDR capture
- Our complete LTE downlink demo
- As many audio demos as we could fit (we have so many now with strong partners like Sensory and Acoustic Technologies working in our booth)
- The display case full of the latest Smartphones and tablets that include Tensilica cores.