Inband Software Offers DSP Development Services for Tensilica Customers

Inband Software can assist in algorithm development, fixed-point conversion, and optimization for Tensilica's HiFi Audio/Voice DSPs and other architectures. Inband Software has experience in a variety of DSP applications including audio and voice codecs, image processing, and digital communications and the company collaborated with Tensilica in the development of several speech codecs, such as G.711, G.726 and G.722, as well as various packet loss concealment modules. See press release.

15 Years!

Yesterday Tensilica celebrated 15 years (to the day) from when founder Chris Rowen files the first papers to start the company. Between lunch and a wonderful cake and champagne celebration, Chris led us on a trip down memory lane, including a trivia quiz (with nice gift card prizes).

Tensilica Joins Wi-Fi Alliance to Provide Wireless Multi-Standard Modem Solutions

Tensilica has joined the Wi-Fi Alliance, an industry consortium dedicated to driving adoption of Wi-Fi and device interoperability. Tensilica, already a leading IP supplier of multi-standard 3G/ LTE and LTE-Advanced modem cores and applications software, also has leading customers using the Tensilica dataplane  processors (DPUs) for some of the older Wi-Fi standards. Now Tensilica plans to integrate Wi-Fi with its multi-standard radio capabilities.  Several of Tensilica's DPUs are ideal for Wi-Fi, including the popular ConnX D2 and the BBE DSP (digital signal processor) product family. Read the rest of the press release.

Will your next TV have Tensilica HiFi Audio inside?

Good changes it will. Samsung and LG are using Tensilica's HiFi Audio DSPs in their newest generations of digital TVs.

Featuring Computers with Tensilica Inside the AMD Radeon UVD Graphics

What do the Apple iMac, Apple MacBook Pro, HP laptops, Lenovo IdeaPad, Toshiba Satellite, Acer Aspire, and a host of desktops have in common? They all use Tensilica's DPUs to accelerate the video stream in AMD's Radeon UVD graphics.

BlackBerry Bold 9790 - With Tensilica's HiFi Inside

Highlighting products that use Tensilica. Today's choice is the BlackBerry Bold 9790 with Tensilica's HiFi audio DSP inside. Great reviews on Amazon.

Tensilica White Paper: 7 Critical Questions to Ask when Adding Audio to your SOC Design

In  a high-stakes game, the selection of an audio solution for each mobile SOC is a major decision. The wrong decision is decidedly perilous for two major reasons.
1.       The wrong decision will harm playback quality that can be obvious when the end products is demonstrated to the customer.
2.       The wrong decision will shorten battery life and will either make the end product less competitive because it's talk time or playback time will be shorter than the competition or because the end product must be larger and heavier than the competition to accommodate a larger battery.
Read the white paper for more information.

Tensilica Doubles DSP Shipments, Ranks Second in DSP IP Market According to The Linley Group

Tensilica is now ranked second in shipments of chips containing DSP IP cores for 2011 by The Linley Group, the industry's leading source for independent technology analysis of semiconductors for networking, mobile, and wireless. Tensilica attributes this growth to its focus on dataplane signal processing and strong unit volumes in smart phones, home entertainment, and communications LTE infrastructure. Shipments of devices with Tensilica DSP cores roughly doubled from 2010 to 2011. See the full press release.

Don't Forget! Two More DAC Panels with Tensilica

IP Packaging – What’s in it for me? - This panel will discuss the pros and cons of IP standardization from various perspectives and explore the rate of adoption of the IP-XACT standard.
Grant Martin, chief scientist, Tensilica
Wednesday, June 6, 2:30 p.m.
Duolog Booth #1520

It’s the Software, Stupid! Truth or Myth – Industry experts will debate three opposing views on the importance of software in product differentiation.
Dr. Chris Rowen, founder and CTO, Tensilica
Thursday, June 7, 1:30 – 3:00 p.m.
Booth #305

Tensilica is in Two Panels at DAC in SF Tomorrow

Hogan's Heroes: Learning from Apple - Panelists will discuss what the electronics industry has learned from Apple.
Jack Guedj, president and CEO, Tensilica
Tuesday, June 5, 10:00 - 11:00 a.m.
Booth #310

System Models -- Does One Size Fit All? - Panelists will review different aspects of system modeling and discuss which abstraction levels best address specific user requirements.
Andrea Kroll, senior product specialist, Tensilica
Tuesday, June 5, 1:30 - 3:00 p.m.
Booth #305