Tensilica is now ranked second in shipments of chips containing DSP IP cores for 2011 by The Linley Group, the industry's
leading source for independent technology analysis of semiconductors for networking,
mobile, and wireless. Tensilica attributes this growth to its focus on
dataplane signal processing and strong unit volumes in smart phones, home
entertainment, and communications LTE infrastructure. Shipments of devices with
Tensilica DSP cores roughly doubled from 2010 to 2011. See the full press release.
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