Tuesday, February 28, 2012
Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium
The second-generation multi-mode LTE/HSPA/3G baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP and the ConnX BBE16 Baseband DSP. As with the first generation NTT DOCOMO-sponsored design now shipping in volume in cell phones and tablets, this chip was co-developed by industry leaders Fujitsu, Panasonic and NEC.
Posted by Tensilica at 10:27 PM