Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium

The second-generation multi-mode LTE/HSPA/3G baseband chip design announced last week by NTT DOCOMO features multiple Tensilica dataplane processors (DPUs), including the HiFi Audio DSP and the ConnX BBE16 Baseband DSP. As with the first generation NTT DOCOMO-sponsored design now shipping in volume in cell phones and tablets, this chip was co-developed by industry leaders Fujitsu, Panasonic and NEC.

Arkamys Audio Enhancement Software and Services Being Ported To Tensilica’s HiFi Audio DSPs

Arkamys digital audio software currently is being ported on Tensilica's HiFi Audio DSPs. This set of software is complemented with the availability of audio design and tuning services. Now designers of products for professional entertainment, digital content companies, and the consumer electronics industry - including mobile phones, tablets, MP3 players, car audio and home theaters - can use Arkamys' software solutions on the popular HiFi Audio DSPs.

Sensory and Tensilica Partner to Offer Complete Speech Recognition Subsystem

Sensory's TrulyHandsfree Voice Control is recognized as providing the most accurate speech activation, a real challenge in noisy environments. It allows users to deliver commands from as far as 20 feet away or in high noise conditions, making it an ideal solution for controlling devices while multitasking or in the car where users need to focus on driving.  It provides a voice trigger capability on a local device that can communicate via the cloud to enable complex voice searches and text-to-speech for data retrieval. It allows Siri-like applications to not require a button press to use, which is more convenient in the car and throughout the home. Tensilica and Sensory will be demonstrating their joint audio solution at Tensilica's booth, #1F39 at the Mobile World Congress, February 27 - March 1, in Barcelona, Spain.

Tensilica’s Leadership in Mobile Audio/Voice and Baseband IP Cores Demonstrated at Mobile World Congress 2012

 Tensilica's DPU IP cores have recently been designed into leading-edge designs from infrastructure providers (for macrocell, picocell and femtocell basestations) as well as handset providers for audio, LTE radio, Bluetooth and other functions.
The most exciting event at Tensilica's stand #1F39 in Hall 1 will be the live demonstration of the simultaneous download of two 1080p HD movies plus an uplink stream from a video camera. These streams are transmitted using Tensilica's Atlas LTE eNodeB platform and received using Tensilica's Atlas LTE UE (user equipment) SPRs (software programmable radios). This showcases how Tensilica's multi-core reference platforms can offer both flexibility and low power while performing LTE eNB and UE transmit/receive functions in real time, with processing strength to spare. See press release for more details.

Tensilica Lays the Foundation for Software Programmable LTE-Advanced User Equipment PHY (Layer 1) in Less than 200mW

After great success in the LTE (Long-Term Evolution) handset baseband market, Tensilica, Inc. today announced that it is driving the transition to LTE-Advanced and has already secured lead customers for its new product - the ConnX BBE32UE DSP (digital signal processor) IP core for baseband SOC (system-on-chip) designs. Using the ConnX BBE32UE DSP core, coupled with Tensilica Baseband Dataplane processors (DPUs), a fully software programmable, flexible modem for LTE-Advanced user equipment category 7 PHY (Layer 1) can be realized in less than 200mW (28 nm HPL process). It can also support 2G, 3G, LTE and HSPA+ standards. See press release.

VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design

VIA determined that Tensilica's DPUs provide over four times the performance of competing processors on key algorithms used to benchmark competitive alternatives.

SSDs require faster and more efficient data management and manipulation to increase their throughput (measured in Input/Output Operations per Second, or IOPS). With conventional processors, increasing the clock speed is the common way to increase performance. However, this increases energy consumption and die size, especially as speeds increase so much that designers are forced to move to more complex multi-core solutions.

Tensilica's DPUs allow designers to customize the IP core, mix both control and signal processing, and add high-bandwidth connectivity to increase performance without increasing the clock speed. For example, designers can use single-cycle bit field manipulation and arithmetic instructions along with multiple simultaneous single-cycle table lookups to achieve over 10 times the efficiency of other processors. This not only increases IOPS, but also significantly reduces the energy consumed and the complexity of the SOC design itself.

mimoOn and Tensilica Offer Complete LTE PHY Reference Platform for User Equipment and eNodeB PHY at Mobile World Congress 2012

The efficient software programmable radio demo is built on Tensilica's Atlas LTE reference platform implementing the flagship ConnX BBE16 DSP (digital signal processor) and Tensilica Dataplane Processors (DPUs). It utilizes mimoOn's mi!MobilePHY software for LTE handsets and their LTE Intermediate Library, which has now been ported to Tensilica's ConnX DPUs. The demonstration is software upgradable so it can also support HSPA+ and WiMAX.

Tensilica will show the demo in Booth 1F39 in Hall 1 and mimoOn will show the demo in Pavilion AV109 on the Avenue at the Mobile World Congress, February 27-March 1, in Barcelona, Spain.

Acoustic Technologies Noise Reduction and Echo Cancellation Software Now Available on Maxim’s MAX98095 Based on Tensilica’s HiFi Audio/Voice DSPs

Acoustic Technologies' SoundClear Mobile Voice 2-mic noise elimination and echo cancellation software has been ported to Tensilica's HiFi Audio DSPs, the leading audio/voice DSP IP cores. It has already been implemented on Maxim Integrated Products' Flexsound processor, which includes Tensilica technology, and is commercially available on Maxim's MAX98095, a member of the company's family of TINI CODECs developed for smartphones, tablets, laptops, and other audio and voice-enabled devices. Tensilica and Acoustic Technologies will be demonstrating their joint audio solution, using the MAX98095, at Tensilica's booth, #1F39 at the Mobile World Congress, February 27 - March 1, in Barcelona, Spain.

Tensilica's Newest Partner - Sonics - With On-Chip Networks

Sonics now supports Tensilica PIF, making it much easier to use Sonics' on-chip networks for SOC design. See the press release for full details.