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Monday, November 26, 2007

eASIC and Tensilica Partnership Delivers Free Diamond Processors on Free Mask Charge ASIC

Tensilica and eASIC announced a partnership to remove the cost barriers for developing custom embedded System-on-a-Chip (SoCs). Through this partnership eASIC now provides free access to Tensilica’s Diamond Standard microprocessor and digital signal processing (DSP) cores for its free mask charge, no-minimum order ASICs. This unique combination enables embedded system designers to develop Diamond processor-based SoCs for applications in any production volume. Designers will now be able to develop customized, highly differentiated ASIC solutions at a lower cost than FPGA-based embedded systems.

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