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Wednesday, February 07, 2007

Tensilica to Showcase Mobile Phones Featuring Its Audio and Video Processors at 3GSM

Tensilica, Inc. will be showcasing mobile phones incorporating its audio and video processors at its booth at the 3GSM World Congress (Hall 2, Level 1, Booth 2.1A67) in Barcelona, Spain, February 12-15, 2007. Tensilica is the leading IP (intellectual property) supplier for mobile multimedia (audio and video) processor cores with its HiFi 2 Audio Engine, its Xtensa configurable processors, and its Diamond Standard VDO (video) family. Tensilica will showcase phones from Cingular, LG Electronics, Motorola, and Samsung that include Tensilica processor cores performing audio and video encoding and decoding.

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