Today's moving day! Tensilica employees are moving to the Cadence campus

It's work-from-home days while the trucks move our stuff over to the Cadence campus. Our new office address is 2655 Seely Avenue, Building 8, San Jose, CA 95134. The main phone number is 408-943-1234. And our Tensilica email addresses will still work, so you can easily get in touch with us.

Cadence's Building 10 - You can't miss it from Montague Expressway in San Jose

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Renesas Licenses Cadence’s Tensilica ConnX D2 DSP for Next-Generation IoT Chip

Combined with the special acceleration packages optimized for IoT wired and wireless modem standards, the ConnX D2 DSP was selected because it met the low-power, small-size and high-performance requirements for Renesas’ new chip, with extra headroom for future standards. The acceleration packages enable a 10X power/performance improvement over the standard ConnX D2 performance.
Read press release.

MStar Licenses Tensilica IP Core from Cadence

“By leveraging the capabilities of the Xtensa DPU, we were able to better optimize our design for higher efficiency,” stated WK Chia, Vice President of Research and Development, MStar. “As a result, we were able to further enhance our home entertainment platform and provide our customers with more cost-efficient solutions.”
Read the press release.

Cadence Tensilica DPU Featured in new GEO Semiconductor Geometric Processing IC for Ultra-Wide Angle Cameras and Pico Projector Based Heads-Up displays

"The GW3300 integrates GEO’s patented eWARP® core and a Tensilica® CPU with parallel and MIPI interfaces on both inputs and outputs. The GW3300’s fully programmable geometry processing engine can correct for complex lens distortion, perspective and rotational misalignment, as well as brightness nonuniformityin real time with as low as 1/6 frame of latency." See GEO's press release.

Cadence First to Demo Complete M-PCIe PHY and Controller Solution at MIPI and PCI-SIG Conferences

One of the hottest (or should I say coolest – because low power is so important) new standards is PCI Express® (PCIe) over M-PHY, or M-PCIe.  To implement it properly, it’s essential that the controller and PHY work well together as the interface specification between them is, to put it mildly, loosely defined. 

Our booth was jammed at the PCI-SIG conference, and our demo of a complete PHY and controller for mobile PCI Express was very impressive.  Find out more on the Cadence blog.

What Cadence's Acquisition of Evatronix Brings to the IP Party

Cadence's expanding IP portfolio now includes Evatronix.  They bring some great IP products to the Cadence mix, including USB solutions, NAND Flash IP, SD Host 4.0, MIPI SLIMbus IP, and an 8051 controller.  Find out more by reading this blog.

Cadence Fellow and Ex Tensilica Founder and CTO Chris Rowen Interviewed about Cadence Acquisition by New Electronics

"He describes the acquisition by Cadence as a watershed advance in the eda and IP business. It is, he believes 'unique in the industry', meshing as it does Tensilica's strengths in assessing a design's system architecture, the functionality, the algorithms needed to run in silicon to accomplish a particular task and how to put all of that together with Cadence's interconnect blocks, design and verification interactions to build the pieces."  Read entire interview here.

See Tensilica in the Cadence Booth at DAC Next Week in Austin

Chris Rowen will be presenting "Goldilocks and the Three Bears of Programmability" in a DAC special session Tuesday 10:30-12.

Steve Roddy will be presenting our new IVP Image/Video processor and Customizable Processor Basics in the Cadence Theater.

And I'll be working the booth near the IP stand. Stop by to play our cool game and win a Samsung tablet or Apple TV. There's a prize for everyone who stops by.

See you there!

See Cadence Fellow Chris Rowen's Presentation on the Tensilica IVP Image/Video Processor

Did you miss Chris' presentation at the Embedded Vision Summit? It's up on YouTube now and you can learn about Porting Applications to High-Performance Imaging DSPs.

See the Tensilica booth at ChipEx 2013 in Israel