More on Nitendo DSi Game

Yes, we're inside, but not in the Bluetooth as previously written. We're inside the WiFi. Sorry about that.

Tensilica's Inside Nitendo DSi Game

Inside every new Nitendo DSi game, there's a Tensilica processor in the Bluetooth chip. Buy Tensilica and have a great time.

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Fastest Growing Semiconductor IP Company

Gartner named Tensilica the fastest growing semiconductor IP company for 2008.

Tensilica HiFi 2 Audio DSP Supports HE AAC by Dolby in Digital Radio Mondiale

The Digital Radio Mondiale (DRM) decoder is now available for our popular HiFi 2 Audio DSP. The implementation is based on software developed by Dolby and has passed Dolby’s certification procedure. Now designers of digital radio systems can use one processor core – Tensilica’s HiFi 2 Audio DSP – to run all decoders required throughout the world for digital radio, enabling a universal worldwide digital radio receiver. Tensilica’s HiFi2 Audio DSP already has support for four other terrestrial and satellite standards: DAB, DAB+, HD Radio, and XM Radio. For more information, see http://www.tensilica.com/news_events/pr_2009_03_30.htm

Tensilica adds new VP

Tensilica has added a key member to its executive team. Mahesh Venkatraman has joined Tensilica as vice president of marketing, vertical segments. In this new position, Venkatraman will report to company president and CEO, Jack Guedj, and is responsible for the marketing, strategic business development, and partnerships for audio, video, and baseband DSP (digital signal processing) vertical segments.

For more info, see http://www.tensilica.com/news_events/pr_2009_03_24.htm

New Bluetooth SBC Decoder and Encoder

Tensilica announced the immediate availability of the Bluetooth sub-band codec (SBC) decoder and encoder for its popular HiFi 2 Audio DSP. Now designers of cellular phones, portable music players and other devices can easily design in Bluetooth capabilities, along with over 50 other audio standards already available, that run on the HIFi 2 Audio DSP. For more information, see http://www.tensilica.com/news_events/pr_2009_02_11.htm

Tensilica Demonstrates Audio, Video and Next-Generation Baseband DSP at Mobile World Congress in Barcelona

Tensilica, Inc. will demonstrate its industry leading audio, video and baseband DSP processor cores for wireless mobile devices and base station systems at the Mobile World Congress (MWC) exhibition in Barcelona next week, February 16-19. Major systems and semiconductor companies will be showcasing products using Tensilica’s technology, and many 4G/LTE, PicoCell and FemtoCell, WiFi, mobile digital radio, and mobile digital TV baseband communications SOC designs are now in progress based on Tensilica’s customizable dataplane processors.

For more information, see http://www.tensilica.com/news_events/pr_2009_02_10.htm

UpZide Offers Expertise in VDSL2, LTE, UWB and Baseband Chip Desi

UpZide Technologies AB is now an authorized Tensilica Software Design Center. Over the past three years, UpZide has worked extensively on designs with Tensilica’s Xtensa customizable processors, and have strong expertise in optimizing these processors for VDSL2 (very high bit rate digital subscriber line), the most advanced standard for DSL communications. UpZide is now available to help other companies with their wireless datapath or baseband designs, including LTE (long-term evolution) and UWB (ultra wideband).

330HiFi Audio DSP Licensed by Fujitsu Microelectronics for Portable Consumer Electronics

“We selected Tensilica’s Diamond Standard 330HiFi Audio DSP for our customer’s portable consumer product,” stated Yoshio Kuniyasu, general manager of the IP Platform Solution Division at Fujitsu Microelectronics Limited. “Our customer realized that the Tensilica solution is one of the best for low power and had an extensive list of available software.”

For more information, see http://www.tensilica.com/news_events/pr_2009_01_27.htm