Tuesday, February 05, 2013
Phison Uses Tensilica for NAND Flash Memory Controllers and SSD Applications
“Tensilica’s DPUs allow us to create highly competitive products that
are optimized for our unique flash architectures without compromising
the implementation or requiring us to create, verify and maintain
algorithm-acceleration offload engines to supplement an inflexible
fixed-function control CPU,” said Aw Yong, President at Phison.
“Moreover, Tensilica’s DPUs have special I/Os that speed data in and out
of the processing engine, bypassing the system bus, speeding overall
system performance.” See press release.
Monday, February 04, 2013
TU Dresden Innovates with Tensilica's Xtensa LX4
With assistance from Tensilica, the
university team integrated an Xtensa LX4 DSP core to demonstrate the overall
power reduction benefits from the combination of a 28nm low power technology,
adaptive power management and an advanced processor IP core.
"Tensilica has had a long-standing relationship with the researchers at TU
Dresden and congratulates them on this successful design effort," stated
Chris Rowen, Tensilca's CTO. "Tensilica's Xtensa processor is a
fundamental building block in TU Dresden's wireless communications
architecture, and we are working together to proliferate know-how on
configurable architectures to the worldwide design community." See press release.
Wednesday, January 16, 2013
Waves MaxxAudio Sound-Enhancement Technology Is Now Available for Tensilica HiFi Audio DSP Cores
MaxxAudio incorporates a host of proprietary signal-processing
technologies to deliver enhanced, dynamic and immersive sound from the
small speakers typically found in many consumer electronics products,
with better definition, deeper bass and a more enveloping sound field.
Tomar Elbaz, Executive Vice President of Waves, stated: “Elevating Tensilica’s portfolio with MaxxAudio studio-quality sound enhancement suite further underscores our company’s commitment to providing the highest-quality audio solutions to consumers. Waves signal processing and audio technologies are used by top pros in the recording industry, and now this level of professional-quality sonic improvement will be available in a much wider range of products from top consumer electronics manufacturers.”
See the press release.
Tomar Elbaz, Executive Vice President of Waves, stated: “Elevating Tensilica’s portfolio with MaxxAudio studio-quality sound enhancement suite further underscores our company’s commitment to providing the highest-quality audio solutions to consumers. Waves signal processing and audio technologies are used by top pros in the recording industry, and now this level of professional-quality sonic improvement will be available in a much wider range of products from top consumer electronics manufacturers.”
See the press release.
Monday, January 07, 2013
Visit Tensilica at CES
Our booth looks great! We're in the LVCC, South Hall, Booth MP25060. I'll probably be sitting out front - Paula
Thursday, January 03, 2013
Tensilica Introduces the Smallest, Lowest Power DSP IP Core For Always-Listening Voice Trigger and Voice Recognition
Tensilica optimized the HiFi Mini DSP core to be as small and power
efficient as possible for voice trigger and voice recognition in two
major ways. First, the core uses compact 40-bit encoding, which
significantly improves code size. Second, Tensilica added
efficient16-bit instructions that are optimized for voice and audio
codecs. The result is a post-route core that’s only 0.039 mm2 in 28 nm HPL. See the press release.
Thursday, December 20, 2012
Tuesday, December 18, 2012
Tensilica to Feature Customer Innovations in Smartphones and Home Entertainment at CES 2013
Tensilica’s booth with a demo area and three meeting rooms is located
in the South Hall of the Las Vegas Convention Center in Meeting Room
25060. To schedule a meeting, please email paula@tensilica.com.
Tensilica will be featuring its audio and baseband DSPs. Among Tensilica’s demonstrations will be:
- Voice trigger and voice commands using the HiFi Audio DSP.
- Fujitsu’s F-12C Smartphones with integrated HiFi Audio.
- The latest Smartphones for NTT Docomo’s 4G LTE network in Japan, which use Tensilica DSPs for the LTE communications.
- Samsung’s 3D Blu-ray Disc™ player with HiFi Audio for 5.1-channel surround sound.
- HD radios with HiFi Audio.
- Samsung’s DTVs with HiFi Audio.
See press release.
Tensilica will be featuring its audio and baseband DSPs. Among Tensilica’s demonstrations will be:
- Voice trigger and voice commands using the HiFi Audio DSP.
- Fujitsu’s F-12C Smartphones with integrated HiFi Audio.
- The latest Smartphones for NTT Docomo’s 4G LTE network in Japan, which use Tensilica DSPs for the LTE communications.
- Samsung’s 3D Blu-ray Disc™ player with HiFi Audio for 5.1-channel surround sound.
- HD radios with HiFi Audio.
- Samsung’s DTVs with HiFi Audio.
See press release.
Wednesday, December 05, 2012
Tensilica is Ready for IC-CAD Conference in China
Tensilica's LTE Demo is up and running - we're ready for the IC-CAD conference in Chongqiang, China. This demo is really cool - A live FPGA board based demonstration of a transmitter (eNodeB) PHY layer implemented with Tensilica cores and a handset PHY layer implemented with Tensilca cores. The demonstration shows a download to the handset of two 1080p HD movies and playback on big LCD monitors.
Tuesday, December 04, 2012
Tensilica Hits Major Milestone: 200 Licensees for Dataplane Processor IP Cores
“Reaching the 200th licensee mark is another testimonial to
our growing success. The universe of potential Tensilica licensees and
applications addressed by Tensilica is much larger than that of other
signal processor licensing companies since our products can range from
tiny, micro DPUs to state-of-the-art, high-performance DSPs,” stated
Jack Guedj, Tensilica’s president and CEO. “A growing number of
customers are adopting Tensilica IP cores because they can get a
significant reduction in time-to-market using our complete hardware and
software subsystem solutions for audio and baseband signal processing
and our state-of-the-art software programming tools.”
Read the press release.
Read the press release.
Monday, December 03, 2012
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