Tensilica News

All the news you're looking for from Tensilica, Inc. Find out how you can use Tensilica's customizable, extensible processors to speed your SOC design. See Tensilica for DSPs and all the processing you need to do in the dataplane (dataplane processors - DPUs).

Tuesday, October 15, 2013

New Cadence Partner offers Voice Processing for Tensilica HiFi Audio DSPs

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Fortemedia's groundbreaking voice processing solution, iS600, is now available optimized for Cadence's Tensilica® HiFi DSPs. The iS6...
Monday, October 14, 2013

AMD's new True Audio features Cadence Tensilica HiFi Audio DSPs

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Read the interview with AMD’s Carl Wakeland . Wakeland is a Fellow Design Engineer and considered the “author” of TrueAudio. TrueAudio incl...
Friday, October 11, 2013

Cadence adds Dolby and DTS SW for Tensilica HiFi Audio DSPs

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Cadence announced that it was the first company to offer an IP core solution supporting Dolby Digital Plus with DS1 and DTS Neural Surround....
Tuesday, September 17, 2013

Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica HiFi Audio/Voice DSP IP

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“Sound quality, performance and low power architecture are critical contributors to our reputation and success with our leading customers,”...
Friday, August 30, 2013

Today's moving day! Tensilica employees are moving to the Cadence campus

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It's work-from-home days while the trucks move our stuff over to the Cadence campus. Our new office address is 2655 Seely Avenue, Buildi...
Wednesday, August 28, 2013

Renesas Licenses Cadence’s Tensilica ConnX D2 DSP for Next-Generation IoT Chip

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Combined with the special acceleration packages optimized for IoT wired and wireless modem standards, the ConnX D2 DSP was selected because ...
Tuesday, August 06, 2013

MStar Licenses Tensilica IP Core from Cadence

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“By leveraging the capabilities of the Xtensa DPU, we were able to better optimize our design for higher efficiency,” stated WK Chia, Vice ...
Friday, July 12, 2013

Cadence Tensilica DPU Featured in new GEO Semiconductor Geometric Processing IC for Ultra-Wide Angle Cameras and Pico Projector Based Heads-Up displays

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"The GW3300 integrates GEO’s patented eWARP® core and a Tensilica® CPU with parallel and MIPI interfaces on both inputs and outputs. Th...
Thursday, June 27, 2013

Cadence First to Demo Complete M-PCIe PHY and Controller Solution at MIPI and PCI-SIG Conferences

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One of the hottest (or should I say coolest – because low power is so important) new standards is PCI Express® (PCIe) over M-PHY, or  M-PC...
Monday, June 17, 2013

What Cadence's Acquisition of Evatronix Brings to the IP Party

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Cadence's expanding IP portfolio now includes Evatronix.  They bring some great IP products to the Cadence mix, including USB solutions,...
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I'm the director of corporate communications at Tensilica. I really believe in our technology and just want to show engineers just how productive they can be with our automated tools.
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