Thursday, January 29, 2009
UpZide Offers Expertise in VDSL2, LTE, UWB and Baseband Chip Desi
UpZide Technologies AB is now an authorized Tensilica Software Design Center. Over the past three years, UpZide has worked extensively on designs with Tensilica’s Xtensa customizable processors, and have strong expertise in optimizing these processors for VDSL2 (very high bit rate digital subscriber line), the most advanced standard for DSL communications. UpZide is now available to help other companies with their wireless datapath or baseband designs, including LTE (long-term evolution) and UWB (ultra wideband).
330HiFi Audio DSP Licensed by Fujitsu Microelectronics for Portable Consumer Electronics
“We selected Tensilica’s Diamond Standard 330HiFi Audio DSP for our customer’s portable consumer product,” stated Yoshio Kuniyasu, general manager of the IP Platform Solution Division at Fujitsu Microelectronics Limited. “Our customer realized that the Tensilica solution is one of the best for low power and had an extensive list of available software.”
For more information, see http://www.tensilica.com/news_events/pr_2009_01_27.htm
For more information, see http://www.tensilica.com/news_events/pr_2009_01_27.htm
Wednesday, January 07, 2009
Tensilica Drives Multimedia and Communications Products at CES 2009
Over 35 companies that either license Tensilica’s popular processor cores, or use merchant market semiconductor products that include Tensilica’s cores, will be displaying products at this week’s International Consumer Electronics Show (CES). These Tensilica-enabled products include some of the most advanced, innovative consumer devices, including Blu-ray Disc players, LCD TVs, cellular phones, WiFi- and W-USB-enabled notebook computers, inkjet and laser printers.
The list of exhibitors at CES that either license Tensilica’s processor cores, or use Tensilica-powered silicon products includes: AMD, Atheros Communications, Belkin, Broadcom, Calibre Technology, Cisco, Cypress Semiconductor, Dell, Denon, D-Link Systems, DS2, Epson, Fujitsu, HP, iBiquity Digital, Intel, JVC, Kodac, Lenovo, LG Electronics, Marvell, Mediaphy, Mitsubishi, Motorola, NEC Electronics, NTT Electronics, NVIDIA, Olevia, Olympus, Panasonic, Samsung, Sony, Toshiba, Validity Sensors, XM Radio and Yamaha. For more info on their innovative products, see http://www.tensilica.com/news_events/pr_2009_01_08.htm
The list of exhibitors at CES that either license Tensilica’s processor cores, or use Tensilica-powered silicon products includes: AMD, Atheros Communications, Belkin, Broadcom, Calibre Technology, Cisco, Cypress Semiconductor, Dell, Denon, D-Link Systems, DS2, Epson, Fujitsu, HP, iBiquity Digital, Intel, JVC, Kodac, Lenovo, LG Electronics, Marvell, Mediaphy, Mitsubishi, Motorola, NEC Electronics, NTT Electronics, NVIDIA, Olevia, Olympus, Panasonic, Samsung, Sony, Toshiba, Validity Sensors, XM Radio and Yamaha. For more info on their innovative products, see http://www.tensilica.com/news_events/pr_2009_01_08.htm
Tensilica Enables Single Audio Core Blu-ray Disc Player SOCs
Tensilica will demonstrate DTS-HD Master Audio Lossless decoding on the HiFi 2 Audio DSP (digital signal processor), the industry’s lowest power, most area efficient audio processor core, at the Consumer Electronics Show in Las Vegas, January 8-11, 2009. The HiFi 2 DSP offers significant cost savings and a simplified programming model, as all Blu-ray audio processing can be done in one core, unlike other solutions that require two or more cores. Tensilica will have a private suite at the Las Vegas Convention Center, South Hall 3 (second floor), meeting place #35672MP. Reserve a meeting now by emailing meetings@tensilica.com.
For more information, see http://www.tensilica.com/news_events/pr_2009_01_07.htm
For more information, see http://www.tensilica.com/news_events/pr_2009_01_07.htm
Tuesday, January 06, 2009
RealAudio Decoder Support for HiFi 2 Audio DSPs
Tensilica has ported the RealAudio 8, 9, and 10 decoders from digital entertainment services company RealNetworks, Inc. (RNWK) to the HiFi 2 Audio DSP, the industry’s leading licensable audio DSP. RealAudio utilizes advanced audio compression techniques to allow users to achieve high quality sound in a wide bandwidth range, and is the preferred media format for many users of cellular phones, portable media players, and mobile Internet devices. For more information, see http://www.tensilica.com/news_events/pr_2009_01_06.htm
Monday, December 15, 2008
MegaChips Becomes Tensilica Authorized Design Center
MegaChips Corporation, of Osaka, Japan, has become an authorized Tensilica design center. Companies needing SOC (system-on-chip) design services in Japan can take advantage of MegaChips’ expertise in the design of video and imaging products as well as communications products. For more information, see http://www.tensilica.com/news_events/pr_2008_12_15.htm
Thursday, December 11, 2008
ASTRI Selects Tensilica Processor Cores for Video Research
Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) has selected Tensilica’s Xtensa customizable processor cores for a video research project. The government of Hong Kong created ASTRI to perform high-quality R&D (research and development) for technology transfer to industry, develop needed technical human resources, and act as a focal point that brings together industry and university R&D assets.
For more information, see http://www.tensilica.com/news_events/pr_2008_12_10.htm
For more information, see http://www.tensilica.com/news_events/pr_2008_12_10.htm
HyperSilicon Becomes New Tensilica Prototyping Partner in China
HyperSilicon Co., Ltd, of Beijing, China, has become Tensilica's newest SOC prototyping partner, supporting customers of both the Xtensa customizable processors and the Diamond Standard processor cores in the growing China market. HyperSilicon has particular expertise in designing FPGA development boards, which are often used to test new chip designs before producing the chip in silicon. More information is available at http://www.tensilica.com/news_events/pr_2008_12_08.htm
Labels:
partner
Friday, December 05, 2008
Sibridge Technologies Becomes Tensilica Authorized Design Center
Sibridge Technologies has become an authorized Tensilica design center, supporting customers of both the Xtensa configurable processors and the Diamond Standard processor cores. Sibridge has offices in Fremont, CA, and Ahmedabad, India, and supports a number of global electronics companies.
Sibridge provides innovative solutions for design, verification, and silicon platform software development of SoCs to semiconductors worldwide. The company offers a unique blend of three critical components in the development of SoCs: design and verification IP portfolios; strong chip design, integration and verification expertise; and pre and post silicon firmware development and validation for streaming media and networking applications.
For more information, see http://www.tensilica.com/news_events/pr_2008_12_04.htm
Sibridge provides innovative solutions for design, verification, and silicon platform software development of SoCs to semiconductors worldwide. The company offers a unique blend of three critical components in the development of SoCs: design and verification IP portfolios; strong chip design, integration and verification expertise; and pre and post silicon firmware development and validation for streaming media and networking applications.
For more information, see http://www.tensilica.com/news_events/pr_2008_12_04.htm
Wednesday, December 03, 2008
P-Product Becomes Tensilica Authorized Software Design Center
P-Product, of Needham, MA, has joined Tensilica’s Xtensions Partner network as an authorized software design center, specializing in efficient implementations of digital signal processing (DSP) software. P-Product has extensive expertise in audio and video as well as in WiMAX and LTE. P-Product has already ported multiple audio software modules to Tensilica’s popular HiFi 2 Audio Engine. For more information, see http://www.tensilica.com/news_events/pr_2008_12_02.htm
Subscribe to:
Posts (Atom)
