Wednesday, February 11, 2009
Tensilica Demonstrates Audio, Video and Next-Generation Baseband DSP at Mobile World Congress in Barcelona
Tensilica, Inc. will demonstrate its industry leading audio, video and baseband DSP processor cores for wireless mobile devices and base station systems at the Mobile World Congress (MWC) exhibition in Barcelona next week, February 16-19. Major systems and semiconductor companies will be showcasing products using Tensilica’s technology, and many 4G/LTE, PicoCell and FemtoCell, WiFi, mobile digital radio, and mobile digital TV baseband communications SOC designs are now in progress based on Tensilica’s customizable dataplane processors.
For more information, see http://www.tensilica.com/news_events/pr_2009_02_10.htm