Follow us on:
Subscribe Twitter Facebook

Thursday, February 28, 2008

Tensilica Configurable Processors Used in Stanford Smart Memories Project

Stanford University’s Smart Memories Project used Tensilica’s Xtensa LX2 configurable processor to develop a multiprocessor computing infrastructure for next generation applications. The Stanford Smart Memories Project has developed a prototype system-on-chip (SOC) design that provides the user the ability to program both the processor and the memory system of a chip-level multiprocessor. Using Tensilica allowed the Smart Memory team to focus on creating a flexible memory system that supports many different memory models, including message passing, coherent shared memory, and transactional memory. The design is currently being evaluated for possible commercial deployment by a couple of large semiconductor companies.

For more information, see http://www.tensilica.com/news_events/pr_2008_02_28.htm

Tuesday, February 26, 2008

SandForce Licenses Tensilica’s Diamond Standard 108Mini for Storage Controller Chipsets

SandForce, Inclicensed the Diamond Standard 108Mini RISC controller core to use in their high-performance storage controller chipset designs.

“We needed a basic, low-cost, small controller, and the Diamond Standard 108Mini perfectly fit our requirements,” stated Alex Naqvi, CEO, SandForce.

For more information, see http://www.tensilica.com/news_events/pr_2008_02_26.htm

Tuesday, February 19, 2008

Samsung Signs Multi-Year License for Tensilica Diamond Standard 330HiFi Audio DSP

Samsung Electronics Co., Ltd. has signed a broad multi-year license for Tensilica’s Diamond Standard 330HiFi audio DSP (digital signal processor). Tensilica’s HiFi architecture is the most popular commercial audio core for system-on-chip (SOC) designs. Samsung will use the Diamond Standard 330HiFi audio DSP in mobile handset and other designs.

“Tensilica’s HiFi 2 audio DSP architecture is a widely adopted, advanced DSP core with over 30 voice and audio encoder and decoder software packages readily available,” stated G. S. Han, vice president of Samsung Electronics, System LSI Division. “After a thorough technical evaluation of Tensilica’s HiFi offering, we found that the Diamond 330HiFi was the right audio DSP for Samsung and will be a key DSP in our IP portfolio for years to come.”

For more information, see http://www.tensilica.com/news_events/pr_2008_02_14.htm